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Accelerating the Engineering of 3-D Glasses with ANSYS HPC

NVIDIA Corporation, based in Santa Clara, U.S.A., deploys ANSYS software to predict phenomena such as large deflection and bending of printed circuit boards (PCBs), thermal creep of solder joints, PCB shock and vibration, and even mechanical performance of 3-D glasses. NVIDIA uses ANSYS technology for a range of applications (including structural, fluids and electro-magnetic simulations) in a high-performance computing(HPC) environment that includes workstations and servers. Recently, NVIDIA examined how it exploited HPC in conjunction with the ANSYS Mechanical product; the team found that incremental changes in hardware configuration, including the use of graphics processing units (GPUs) to accelerate the solver, could increase the number of simu- lations that could be performed within a given time frame.