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Featured Case StudyRelying on ANSYS Composite PrepPost helped EADS Innovation Works to develop lightweight composites in aircraft design. ANSYS Composite PrepPost provided simple pre- and post-processing of composite...Stay
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This one-hour presentation from CAE Associates, ANSYS and IEEE Philadelphia, examines the difficult challenges faced in electronic design and reveals ways simulation can enable engineers to predict complex electronics systems performance.
Kiewit Corporation, a diverse company specializing in construction, mining, oil, gas, power, transportation, and water projects, was contracted to design a boundary wall around a large electrical switching station. One of the requirements of the design was to prevent a medium duty truck from penetrating through the wall, as detailed in the crash test specifications of ASTM F2656-07. Kiewit contacted CAE Associates to request dynamic structural analyses to simulate the wall impact events for two different wall designs at different impact angles and locations.
CAE Associates has created a series of input files that will generate the response spectrum for the 3 common types of shock impulses.
Calcresp_halfsin.inp – Half-sine
Calcresp_saw.inp - Sawtooth
Calcresp_trap.inp - Trapezoidal
ANSYS SpaceClaim Direct Modeler (SCDM) software provides easy and fast tools to get geometry ready for simulation. Engineering Manager Eric Stamper showcases the capabilities you now have in v17 with your Mechanical Enterprise license. SCDM uses a new approach to manipulate your CAD models, which makes the geometry become completely dynamic, allowing you to move, stretch and add and remove geometry features with ease. All changes to the geometry occur in real time, enabling instant feedback on design iterations.
Mechanical Solutions Incorporated designed a platform for testing axial fans at different speeds. The platform was designed to avoid any natural frequencies within the test speed range of the fans. A number of design iterations were required until a design was proposed that could satisfy the frequency criteria (safety margin from major excitation sources) without creating an excessively large and heavy structure.
LSI Corporation uses ANSYS tools to model the behavior of a system on a chip (SOC) under load; engineers also diagnose and solve both power integrity and signal integrity issues in a single environment. LSI designs semiconductors and software that accelerate storage and networking in datacenters, mobile networks and client computing. The company developed a methodology to address power and signal integrity issues in a holistic manner by leveraging ANSYS chip–package–system solutions.
Using a wireless device in close proximity to the human body creates a number of major design challenges. The radiated power of the device must be kept below levels that can create a health hazard. The device’s power consumption, size, aspect ratio and weight must be minimized to make it suitable for wearing. Yet the device must be designed to deliver a signal of sufficient power to the right location, with good reception by the target device — despite the fact that the human body may absorb a significant portion of the signal.
Interconnect Engineering Inc. has long used and supported ANSYS electronic design tools, this project provided the opportunity to put the new ANSYS Electronics Desktop to the test. This tool provided a major advantage in this application by reducing the amount of time required to analyze the design in both the time and the frequency domains. The Electronics Desktop integrates EM tools, circuit/system simulation, ECAD links and compliance reporting. This new technology delivers a single desktop for system simulation design.
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