In part one of this series, I discussed modeling approaches for the complex geometry found in printed circuit boards. In this post, I’ll discuss methods for characterizing the thermal properties of integrated circuit (IC) packages. Analysis of IC packages is critical at many levels of the design process, including package level thermal design, board level modeling including heat sink designs and package viability, as well as system level flow and thermal characterization.
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Michael Kuron Ph.D. CFD Managert:/ f:203.758.2914203.758.2965
Mike Kuron has extensive experience managing and performing CFD consulting projects across a wide range of applications, including the aerospace, nuclear, defense, power generation, and electronics industries. He earned his Ph.D. at the University of Connecticut, concentrating in the field of computational turbulent combustion. His Ph.D. research focused on developing models for species mixing in turbulent premixed flames, as well as transported probability density function methods in turbulent combustion. As CFD Manager at CAE Associates, Mike manages all computational fluid dynamics activities, including consulting, software sales, technical support, and training.
Outside of the office, Mike likes to spend his time playing golf, where his handicap will hopefully start going down since completing his Ph.D.
Ph.D., Mechanical Engineering, University of Connecticut
Master of Science, Mechanical Engineering, University of California, Los Angeles
Bachelor of Science, Mechanical Engineering, Villanova University
Recent Posts:April 18, 2017
As electronic devices become smaller and more ubiquitous, the printed circuit boards and components that drive them face increasing power densities and evermore complexity. To ensure product reliability and performance, accurate and detailed analysis methodologies are necessary. In this multi-part series, Mike Bak and I will discuss modeling approaches for the thermo-mechanical analysis of printed circuit boards and their components. In part one of this series, I will cover modeling approaches for the PCB itself.
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